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Intel CPU BX8070811700KF

$605.00

In stock

11th Gen Rocket Lake: i7-11700KF CPU 3.6GHz (5.0GHz Turbo) LGA1200 8-Cores 16-Threads 16MB 125W (NO GPU) not include fan, heatsink or thermal paste.

Specifications

Essentials

Product Collection

11th Generation Intel® Core™ i7 Processors

Code Name

Products formerly Rocket Lake

Vertical Segment

Desktop

Processor Number

i7-11700KF

Status

Launched

Launch Date

Q1’21

Included Items

Please note: The boxed product does not include a fan or heat sink

Lithography

14 nm

Use Conditions

PC/Client/Tablet

Performance

# of Cores

8

# of Threads

16

Processor Base Frequency

3.60 GHz

Max Turbo Frequency

5.00 GHz

Cache

16 MB Intel® Smart Cache

Bus Speed

8 GT/s

Intel® Turbo Boost Max Technology 3.0 Frequency*

5.00 GHz

Intel® Turbo Boost Technology 2.0 Frequency*

4.90 GHz

TDP

125 W

Configurable TDP-down Frequency

3.10 GHz

Configurable TDP-down

95 W

Memory Specifications

Max Memory Size (dependent on memory type)

128 GB

Memory Types

DDR4-3200

Max # of Memory Channels

2

Max Memory Bandwidth

50 GB/s

ECC Memory Supported*

No

Expansion Options

Scalability

1S Only

PCI Express Revision

4.0

PCI Express Configurations*

Up to 1×16+1×4, 2×8+1×4, 1×8+3×4

Max # of PCI Express Lanes

20

Package Specifications

Max CPU Configuration

1

Thermal Solution Specification

PCG 2019A

T JUNCTION

100°C

Package Size

37.5mm x 37.5mm

Advanced Technologies

Intel® Deep Learning Boost (Intel® DL Boost)

Yes

Intel® Thermal Velocity Boost

No

Intel® Turbo Boost Max Technology 3.0*

Yes

Intel® Turbo Boost Technology*

2.0

Intel vPro® Platform Eligibility*

No

Intel® Hyper-Threading Technology*

Yes

Intel® Virtualization Technology (VT-x)*

Yes

Intel® Virtualization Technology for Directed I/O (VT-d)*

Yes

Intel® VT-x with Extended Page Tables (EPT)*

Yes

Intel® 64

Yes

Instruction Set

64-bit

Instruction Set Extensions

Intel® SSE4.1, Intel® SSE4.2, Intel® AVX2

Idle States

Yes

Enhanced Intel SpeedStep® Technology

Yes

Thermal Monitoring Technologies

Yes

Intel® Identity Protection Technology*

Yes

Intel® Stable Image Platform Program (SIPP)

No

Intel® Gaussian and Neural Accelerator 2.0

Yes

Security & Reliability

Intel® AES New Instructions

Yes

Secure Key

Yes

Intel® Software Guard Extensions (Intel® SGX)

No

Intel® OS Guard

Yes

Intel® Trusted Execution Technology*

No

Execute Disable Bit*

Yes

Intel® Boot Guard

Yes

All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided “as-is” and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

*This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

© Intel Corporation. Intel, the Intel logo, and other Intel marks are trademarks of Intel Corporation or its subsidiaries. Other names and brands may be claimed as the property of others.

Description

11th Gen Rocket Lake: i7-11700KF CPU 3.6GHz (5.0GHz Turbo) LGA1200 8-Cores 16-Threads 16MB 125W (NO GPU) not include fan, heatsink or thermal paste.

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